1. 2. 3. material content data sheet sales product name tld5098el issued 28. august 2013 ma# MA000982098 package pg-ssop-14-3 weight* 83.26 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.131 2.56 2.56 25601 25601 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 103 non noble metal zinc 7440-66-6 0.034 0.04 414 non noble metal iron 7439-89-6 0.689 0.83 8276 non noble metal copper 7440-50-8 27.978 33.60 34.48 336046 344839 wire noble metal gold 7440-57-5 0.395 0.47 0.47 4739 4739 encapsulation organic material carbon black 1333-86-4 0.099 0.12 1190 plastics epoxy resin - 4.558 5.48 54752 inorganic material silicondioxide 60676-86-0 44.890 53.92 59.52 539186 595128 leadfinish non noble metal tin 7440-31-5 0.976 1.17 1.17 11724 11724 plating noble metal silver 7440-22-4 0.768 0.92 0.92 9220 9220 glue plastics epoxy resin - 0.182 0.22 2187 noble metal silver 7440-22-4 0.546 0.66 0.88 6562 8749 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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